Renesas scales SoCs for high-end instrument clusters

Renesas R-Car E3 SoC for high-end 3D graphics instrument clusters

Renesas has extended the scalable range of its system-on-chip (SoC) devices with the R-Car E3 to realise high-end 3D graphics on 31.5cm 1920 by 720 pixel displays used for automotive instrument clusters.

Combining smooth 3D rendering capabilities with integrated audio DSP and other peripheral functions, the single-chip SoC supports instrument clusters as well as in-vehicle infotainment (IVI) with display audio and other capabilities.

Saving lives was drive behind Mobileye purchase, says Intel chief

Brian Krzanich

It was all about saving lives, according to Intel chief executive Brian Krzanich, explaining why he led the $15.3bn takeover of Mobileye. He said that a year ago he recognised that Intel's end-to-end platform for autonomous driving wasn't complete.

“Large gaps existed,” he said. “We couldn't create the amazing experiences we wanted to and, more important, we weren't able to complete the vision for saving lives.”

Driver Assistance: Put a SoC in it

Architectural blocks for multiple camera system

Aaron Behman from Xilinx and consultant Adam Taylor discuss considerations for adas and the advantages of programmable SoCs

SoC paves path to connected cars

An automotive system-on-chip (SoC) to address integrated dashboard and information device market demands has been introduced by Renesas Electronics. The R-Car M2 can deliver more than 12,000DMips.

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