Continental and Fujitsu work together at show

International automotive supplier Continental and Fujitsu Semiconductor Embedded in Austria joined forces at last month’s fourth Automotive Cockpit HMI in Bonn. Fujitsu is an HMI tool provider and development partner for worldwide automotive, industrial and telecommunications users.

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Three processors suit automotive instrument clusters

Three intelligent display processors for automotive instrument clusters have been introduced by Toshiba Electronics. For TFT LCD sizes from typically 7.6 to 20.3cm , the Capricorn-Bt0, Capricorn-Bt1 and Capricorn-C0 use the Arm Cortex-R4 core.

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McLaren sets up technology centre in Singapore

McLaren Applied Technologies (Mat) has established the headquarters of its Asia Pacific operations in Singapore. The announcement was made ahead of the 2013 Singapore Grand Prix and the new HQ will be the first registered Mat office outside the UK.

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Elsner heads Renesas’ European automotive group

Renesas Electronics has promoted Günther Elsner (pictured) to general manager of its European automotive business group. Previously head of sales for the group, Elsner replaces Gerd Look, who has been appointed president of Renesas’ European operations.

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Slim computer suits in-vehicle applications

Claimed to be one of the world's slimmest fanless embedded computers at 20mm thick, the AEC-6401 from Aaeon uses the Intel Atom N2600 1.6GHz processor and NM10 chipset.

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Nohau in-circuit emulators return to UK

Phaedrus Systems has been made the exclusive UK distributor of the Nohau embedded systems tools from ICE Technology. Phaedrus will be selling and supporting Nohau's hardware, including spares and upgrades, and the full range of related software for embedded system development.

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Caps like it hot

Syfer Technology has expanded its X8R dielectric range of multilayer chip capacitors (MLCCs) from a working voltage of 250V DC up to 3kV DC. They will also be available in capacitance values from 270pF to 1.8µF, with tolerances of ±5, ±10 and ±20% dependant on CV value.

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Case study: In-vehicle computers help electric buses cut fuel use and emissions

Electric buses in downtown and suburban areas in Japan are using Nexcom in-vehicle computers to cut fuel consumption and reduce carbon dioxide (CO2) emissions.

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Antenna optional on wireless modules

Using advances in power saving technology, Young Electronics has released four Bluetooth 4.0 low-profile wireless transceiver modules from Fujitsu Components. These complement its existing range of Bluetooth and wireless lan modules.

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MLCCs claim world record

Automotive-grade MLCCs with C0G temperature characteristics and rated voltages from 100 to 630V are available from TDK. The components in the CGA series have capacitance values that are said to be high for C0G components.

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